Indentation and Scratching with a Rotating Adhesive Tool: A Molecular Dynamics Simulation Study

Abstract For the specific case of a spherical diamond nanoparticle with 10 nm radius rolling over planar Fe surface, we employ molecular dynamics simulation to study processes indentation and scratching. The particle is rotating (rolling). We focus on influence adhesion force between surface damage mechanisms surface; modeled by pair potential arbitrarily prescribed value strength. With increasing adhesion, following effects are observed. load needed for decreases so does effective material hardness; this effect considerably more pronounced than non-rotating particle. During scratching, tangential force, hence friction coefficient, increase. torque keep adds total work scratching; however, without slip minimum. In sense, induces most efficient scratching process. both length dislocation network generated in substrate reduces. After leaving (partially) covered atoms scratch groove roughened. demonstrate that these based atom transport under from front towards rear; already occurs repulsive but severely intensified adhesion.